GRINDING / POLISHING / WAFER CUTTING / POLISHING POWDER FOR GRINDING WHETSTONE
Chemical composition
| Product |
Al2O3(%) |
ZrSiO4 |
SiC |
SiO2 |
TiO2 |
Others |
| A |
95.55 |
|
|
|
2.5 |
1.95 |
| WA |
99.6 |
|
|
0.001 |
|
0.41 |
| MO |
45 |
55 |
|
|
|
|
| GC |
|
|
99.38 |
|
|
0.7 |
| C |
|
|
more than 92.0 |
|
|
0.8 |
dimensions
|
Supply Mesh (precision polishing)
|
Supply Mesh (rough lapping)
|
| Mesh |
#240 #400 #600 #800 #1000 #1200 #1500
#2000 #2500 #3000 #4000 #6000 #8000 |
#8 ~ #220 |
A / MO / WA Specification
| Mesh |
Particle Size |
Mesh |
Particle Size |
| #240 |
40 ㎛ |
#1500 |
6.3 ㎛ |
| #400 |
23 ㎛ |
#2000 |
5.2 ㎛ |
| #600 |
16 ㎛ |
#3000 |
4.0 ㎛ |
| #800 |
11.5 ㎛ |
#4000 |
3.0 ㎛ |
| #1000 |
10.0 ㎛ |
#6000 |
2.0 ㎛ |
| #1200 |
7.5 ㎛ |
#8000 |
1.5 ㎛ |
GC / C Specification
| Mesh |
Particle Size |
Mesh |
Particle Size |
| #240 |
57 ㎛ |
#2000 |
6.7 ㎛ |
| #400 |
30 ㎛ |
#2500 |
5.5 ㎛ |
| #600 |
20 ㎛ |
#3000 |
4.0 ㎛ |
| #800 |
14 ㎛ |
#4000 |
3.0 ㎛ |
| #1000 |
11.5 ㎛ |
#6000 |
2.0 ㎛ |
| #1200 |
9.5 ㎛ |
#8000 |
1.2 ㎛ |
| #1500 |
8.0 ㎛ |
|
|
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